November 10, 2026
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SEMICON Europa 2026 is the leading European platform for the semiconductor and microelectronics industry, held from 10 to 13 November 2026 at Trade Fair Center Messe München in Munich, Germany. Organised by SEMI Europe, the event is co-located with electronica, the world's leading trade fair for electronics, creating the strongest single event for electronics manufacturing in Europe and providing access to the full electronics and semiconductor value chain from research to application. The 2026 theme is "Powering Sustainable Exponential Growth to Support the Semiconductor Ecosystem." The exhibition covers semiconductors, LEDs, and MEMS technologies across dedicated halls, while the conference programme includes the Executive Forum, the Advanced Packaging Conference, the Fab Management Forum, the SEMI 3D and Systems Summit, and a first-of-its-kind venture-building hackathon bringing together interdisciplinary talent from across Europe. A single ticket grants access to both SEMICON Europa and electronica.
SEMICON Europa draws a highly specialised audience spanning semiconductor manufacturers, equipment and materials suppliers, foundries, EDA and design tool providers, packaging specialists, research institutions, OEMs, Tier 1 automotive suppliers, and microelectronics policymakers from across Europe and globally. Confirmed exhibitors for the 3D and Systems Summit include Adeia, ASE, ASMPT, Carl Zeiss Microscopy, Comet AG, Forschungsfabrik Mikroelektronik Deutschland (FMD), Fraunhofer IZM-ASSID, Lam Research, LPKF Laser and Electronics, NanoIC Pilot Line, Plasmatreat, SET (Smart Equipment Technology), W.L. Gore and Associates, Wooptix, and X-FAB Silicon Foundries, among others. Key sponsors include KLA, Evatec, EV Group, imec, and MKS Atotech. The event brings together start-up founders, established industry leaders, researchers, and investors exploring new opportunities across the semiconductor ecosystem.
The four-day programme combines a major trade exhibition with a rich conference and forum schedule. The Executive Forum brings together C-suite leaders for strategic dialogue on the European semiconductor industry's direction. The Advanced Packaging Conference addresses heterogeneous integration, chiplet architectures, and advanced packaging technologies, building on the 3D and Systems Summit's focus areas. The Fab Management Forum addresses operational excellence, sustainability, and workforce strategy in semiconductor manufacturing. The Smart Mobility session unites OEMs, Tier 1 suppliers, semiconductor manufacturers, and foundries to examine how next-generation semiconductor solutions are accelerating smart vehicle technology. The Power Semiconductors session covers efficiency, cost versus performance trade-offs, and manufacturing advances enabling the electrification transition. A dedicated start-up and entrepreneur session provides a platform for innovators across the ecosystem, alongside the launch of a venture-building hackathon for European talent. Networking events and community sessions run throughout all four days.
The agenda addresses the full spectrum of the European semiconductor and microelectronics value chain. Key themes include the role of semiconductors in enabling the All Electric Society across energy, mobility, and industrial applications; heterogeneous integration and advanced packaging as strategic priorities for European chipmakers; power semiconductors and their role in electrification across automotive, industrial, and energy sectors; semiconductor supply chain resilience and strategies for reducing European dependencies on non-European supply; smart manufacturing, Industry 4.0, and factory digitalisation in semiconductor fabs; the European Chips Act and its implications for investment, capacity, and strategic autonomy; MEMS and sensor technology innovation; sustainable semiconductor manufacturing including energy efficiency, resource consumption, and circular economy practices; workforce development and talent attraction for the semiconductor sector; medtech and healthcare applications of advanced microelectronics; and the evolving landscape of European semiconductor start-ups and venture investment.
SEMICON Europa 2026 concludes on 13 November at Messe München, closing in parallel with electronica on the final day of Europe's largest combined electronics and semiconductor event. The four-day programme brings together the entire European semiconductor ecosystem, reinforcing Munich's role as the continent's most important annual gathering point for microelectronics innovation, industry strategy, and supply chain partnership.
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